Job Description
We are seeking a highly skilled Optomechanical Packaging & Manufacturing Engineer to lead the development and optimization of packaging solutions for optoelectronic devices. This role focuses on process improvement, material selection, design for manufacturability, and cost-effective, high-yield production. You will collaborate with cross-functional teams, ensuring product reliability, compliance, and scalability.
Key Responsibilities:
- Develop and optimize packaging solutions for photodiode devices across various market segments.
- Drive NPI processes, ensuring designs meet internal and customer specifications.
- Establish baseline process capabilities, implementing improvements for yield and efficiency.
- Lead material selection, design verification, and process qualification for advanced packaging.
- Conduct Design of Experiments (DOE) and statistical analysis for process optimization.
- Ensure compliance with ISO9001 standards and support audits.
- Collaborate with quality, supply chain, and manufacturing teams to streamline operations.
- Provide technical leadership to enhance next-gen fabrication and assembly capabilities.
Qualifications:
- BS/MS in Mechanical Engineering, Material Science, or related field.
- 8+ years of experience in optoelectronic packaging, semiconductor, or photonics manufacturing.
- Expertise in manufacturing processes, material properties, and packaging techniques.
- Strong background in Six Sigma, DOE, and root cause analysis.
- Experience in FEA-based analysis for photonics packaging is a plus.
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