Job Description

We are seeking a highly skilled Optomechanical Packaging & Manufacturing Engineer to lead the development and optimization of packaging solutions for optoelectronic devices. This role focuses on process improvement, material selection, design for manufacturability, and cost-effective, high-yield production. You will collaborate with cross-functional teams, ensuring product reliability, compliance, and scalability.

Key Responsibilities:

• Develop and optimize packaging solutions for photodiode devices across various market segments.
• Drive NPI processes, ensuring designs meet internal and customer specifications.
• Establish baseline process capabilities, implementing improvements for yield and efficiency.
• Lead material selection, design verification, and process qualification for advanced packaging.
• Conduct Design of Experiments (DOE) and statistical analysis for process optimization.
• Ensure compliance with ISO9001 standards and support audits.
• Collaborate with quality, supply chain, and manufacturing teams to streamline operations.
• Provide technical leadership to enhance next-gen fabrication and assembly capabilities.

Qualifications:

• BS/MS in Mechanical Engineering, Material Science, or related field.
• 8+ years of experience in optoelectronic packaging, semiconductor, or photonics manufacturing.
• Expertise in manufacturing processes, material properties, and packaging techniques.
• Strong background in Six Sigma, DOE, and root cause analysis.
• Experience in FEA-based analysis for photonics packaging is a plus.

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